Media Kit

OX3’s Address
OX3 Corporation
9 Orion Park Drive
Ayer, Massachusetts 01432


Media Contact:
Gus Widmayer, President
(978) 772-2600, Opt. 1, Ext. 9700
Pricing Guide:
Click for Pricing Guide
Corporate Origins:
Founded as Orion Partners in 1972 to perform small subassemblies, the organization was incorporated in 1973 as Indus-Orion Corporation. It underwent a name change in 1980 to Orion Industries Incorporated. In 1991, the taping and reeling division, known as Orion Electronics Corporation, was spun off as a standalone company in a management buyout, with a dba of Orion Tape and Reel. In 2000, the name was changed to OX3 Corporation.
We employ approximately 20 full-time people.
Corporate Mission:
To become the supplier of choice in the Value-added Services sector of the Automated Component Handling industry. The company packages IC’s and semiconductors for use on automated pick and place equipment, which is the predominant method employed today in the assembly of printed circuit boards.
Primary Services:
Taping and reeling, baking of surface-mount integrated circuits, passive chips, and the distribution of the materials required for same.
Primary Market And Size:
The Electronics Industry, $35 Billion for packaging semiconductors on tape and reel, (not including OEM in-house operations).
Unit Price:
Typically ten cents per part.
Product Development:
Packaging methods have evolved in three stages. Begun in 1960, axial lead components were placed between two tapes. In 1970’s, radial lead components were placed on a single tape. In 1980’s, surface mount components were placed in pocketed tapes. Currently, these carrier tapes still reign, only the products being packaged are smaller, like 0202 chips, or sturdier, like BGA’s, or more differentiated, like CSP’s.
Domestic Sales and Service:
The company utilizes one central corporate sales and marketing team to canvas all territories.
Manufacturing Strategy:
Operations are set up to handle On-demand, Same-day, Next-day and Two-day delivery of services

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