Packaging for Semiconductors

Adding value to semiconductors since 1972

Menu

Skip to content
  • Home
  • Applications
    • Market Overview
    • Distributors
    • OCM’s and ISM’s
    • Defense and Aeronautics
  • Let’s Meet!
    • Let’s Talk!
    • Team
    • Welcome! and Thank you!
    • A Letter From Gus
    • History
  • Library
    • Acronyms
    • Document Store
  • Products
    • Axial Lead Taping
    • Products Overview
    • Carrier Tapes
    • Cover Tapes
    • Plastic Reels
    • Semiconductors
    • Kapton Pads
    • Trays
    • SMT Splicing REELwrap®
    • Packages and Services
    • Tubes
    • Custom Jars

TSOP-32 Type 1, Var. “BD”

April 25, 2016May 20, 2016 • ox3com

Today, OX3 processed an order for TSOP-32 pin, Type 1 devices with JEDEC body variation “BD”.  These were packaged in our tray P/N OX3T1130.

TSOP-032

TSOP-32 Type 1, JEDEC Variation “BD”

Share this:

  • Twitter
  • Facebook
  • LinkedIn
  • Skype
  • Email

Like this:

Like Loading...
Posted in carrier tape, Glossary, Microcontrollers, OSATS, Package names, Pick 'n Place, Semiconductors, tape and reelTagged JEDEC TraysBookmark the permalink.

You must log in to post a comment.

Post navigation

Punched Paper Carrier
Pi = c/d
Powered by WordPress.com.
 

Loading Comments...
 

You must be logged in to post a comment.

    %d bloggers like this: