Providing packaging for the Ultra-Reliable LQFP from NXP Semiconductors.

Used by our clients in Next-Generation Automotive and Industrial Applications! Did you know that the Next-Gen MCU from NXP Semiconductors is ultra-reliable and provides a highly integrated, safe and secure single-chip solution for next-generation automotive, industrial control, and gateway applications? One of the features of these MCUs that stands out is their enhanced low-power capabilities, providing increased functionality while operating more efficiently.

In addition, the hardware security module offers robust protection against various attack scenarios, ensuring the safety of your Electronic Control Units (ECUs). Furthermore, Functional safety support simplifies compliance for automotive safety systems targeting ISO 26262 and higher-end ASIL levels.

The package outline, HLQFP176 comes in a plastic, thermal enhanced low profile quad; flat leaded package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body. These are ideally suited for complex pocketed carrier tapes where the addition of a "lead-well" introduces a K1 to the Ko pocket depths for lead protection.

If you have a unique packaging application, feel free to drop us an email with your requirements, and we will help you obtain the packaging in a speedy manner and provide a personalized service.
Providing packaging for the Ultra-Reliable LQFP from NXP Semiconductors.

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