RADIAL-LEAD LEGACY
At its heyday in the 1970’s, radial-leaded device packaging was the leading edge of assembly technology. With its vertical-mount orientation, radial device packages vastly reduced the real estate required on a printed circuit board. While radial configuration has been surpassed by surface-mount technology, the product has not reached end-of-life. OX3.com continues to process radial-lead devices, with SAME-Day turns, for one of the world’s largest capacitor OCM’s.
