| Family | Anagram | Description |
| BGA | BG | BGA - generic |
| CBGA | CB | CBGA, (Ceramic Ball Grid Array. The thickness and depth are maximum dimensions. The solder ball are made of a high melt non-eutectic composition (10% Sn/ 90% Pb). |
| DSBGA | CB1 | DSBGA, (Die Size Ball Grid Array. DSBGA is a type of BGA package where the body size is defined to coincide as closely as possible with a specific die size. These packages are sometimes called CSP packages. The solder balls consist of eutectic lead/ tin solder). |
| eBGA | CB2 | eBGA, (Enhanced BGA (EBGA) is a wire bonded, cavity down package). |
| FBGA | CB3 | FBGA, (Fine-Pitch Ball Grid Array. These are BGA packages with grid pitches less than 1.0 mm. These devices use Flip-Chip interconnect technology and are sometimes called Chip Scale Packages. The solder balls typically consist of Eutectic lead/tin solder). |
| FCBGA | CB4 | FCBGA, (Flip Chip Ball Grid Array. These also come in micro-FCBGA packages). |
| PBGA | CB5 | PBGA, (Plastic Ball Grid Array Packages: Rectangular (R-PBGA-B) and Square (S-PBGA-B) Styles. Maximum depth is 3.50 mm. The ball matrix is represented in the parantheses). |
| TBGA | CB6 | TBGA, (Tape Ball Grid Array. TBGA packages are made from strips of Polyamide tape. A metal plate "stiffener" is incorporated on top of the package for added strength. The nominal solder ball diameter for high melt solder balls is 0.63 mm and 0.60mm for low melt). |
| CCGA | CC | Ceramic Column Grid Array, Rectangular and Square Max. depth is 7.40mm. The column matrix is represented in the parantheses. Nominal solder column diameter is 0.55mm for 1.50 and 1.27mm pitches, and is 0.51mm for 1.00mm pitch. |
| CERDIP | CE | This CDIP is dry pressed ceramic hermetically sealed around a dip formed leadframe. |
| CPGA | CG | Ceramic Pin Grid Array |
| Chips | CH | Chip Capacitors: The chips could be either Resistors or Capacitors. Bare Die: |
| CSOJ | CJ | Small Outline J-Lead Ceramic Family |
| Chips | CL | Chip Resistors |
| CLCC | CQ | Ceramic Leadless Chip Carrier |
| CERQUAD | CR | Ceramic Quad Package. They comes into lead forms: Gull Wing (Quad Flatpack package) and "J" Lead (PQCC package) |
| Cases | CS | SSLB Type Tinned Receptacle (Male) |
| Connectors | CT | Connector, (Receptacles are "female," and Headers are "male.") |
| DSBGA | DB | DSBGA, (Die Size Ball Grid Array). DSBGA is a type of BGA package where the body size is defined to coincide as closely as possible with a specific die size. These packages are sometimes called CSP packages. The solder balls consist of eutectic lead/ tin solder. |
| DFN | DF | Dual Flat No Lead Package, (DFN)-Very Thin (HP-VFDFP-N, Body Thickness-1.0 mm) and Very Very Thin (HP-WFDFP-N, Body-0.8 mm). These are also sometimes called Micro Leadframe Dual (MLPD) packages. Rectangular packages could be either Type 1 or 2 styles. |
| D-Pak | DK | Diode (Surface Mount Package) |
| DIP | DN | Dual In-line Package |
| DQFN | DQ | Dual Compatible Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Quad Flat No Lead Package Families. It is essentially a QFN package, with only two leads each on shorter edges. |
| EBGA | EB | eBGA, (Plastic Enhanced BGA). This is a wire bonded, cavity-down package. |
| FBGA | FB | FBGA, (Fine Line or Fine-Pitch Ball Grid Array). These are BGA packages with grid pitches less than 1.0 mm. These devices use Flip-Chip interconnect technology and are sometimes called Chip Scale Packages. The solder balls typically consist of Eutectic lead/tin solder. |
| FCBGA | FC | FCBGA, (Flip Chip Ball Grid Array). These also come in micro-FCBGA packages. |
| FET | FE | Field Effect Transistor, aka (Disk Button) |
| Flatpack | FP | Flatpack. JEDEC Package Designator: R-GDFP-F. |
| Semiconductor | G | This category is for semiconductor devices purchased by OX3 in the normal course of packaging. |
| GDIP | GD | Glass Dual In-Line Package |
| Heatsink | HK | A metal device utilized to extract and dissipate heat. |
| HSSOP | HS | Heat Slug Small Outline Package. |
| Inductor | ID | Inductor |
| SOJ | JS | Small Outline "J" Lead Package. The body width is indicated in the parantheses. |
| KDIP | KD | Skinny Dual In-Line Package |
| SKSJ | KJ | Socket for SOJ |
| PKDIP | KN | Plastic Skinny Dual In-line Package |
| LDCC | LC | Leaded Chip Carrier |
| LGA | LG | Land Grid Arrays |
| LSOJ | LJ | Low Profile Small Outline J-lead Package (LSOJ). JEDEC Designation: PRSO-J/LSOJ. Max. Depth is 2.05 mm |
| LLCC | LL | Leadless Chip Carrier |
| LTCC | LT | Low-temperature co-fired ceramic MCM |
| MBGA | MB | MBGA, (Micro Fine Line BGA). |
| MSOP | MS | Micro SOIC Packages. The body width is indicated in the parantheses. MSOP-08 (2.30) is also sometimes known as TSOP2-08 (2.30) package. |
| Optocoupler | OC | Optocouplers. |
| Odd-Form | OF | Odd-Form Devices |
| Oscillator | OS | Oscillator: A circuit or device that produces an alternating current of a specific frequency at its output terminals. |
| PBGA | PB | PBGA, (Plastic Ball Grid Array Packages). These come in rectangular (R-PBGA-B) and square (S-PBGA-B) styles. Maximum depth is 3.50 mm. The ball matrix is represented within the parentheses. |
| PDIP | PD | Plastic Dual In-line Package |
| PFP | PF | Plastic Flatpacks |
| PGA | PG | Pin Grid Arrays |
| PQCC | PQ | Plastic Lateral Chip Carrier. The standard lead pitch on each is 1.27 mm, (JEDEC SOT187) |
| LCC | QC | Leadless Chip Carrier: There are four types of LCCs based on terminals and their locations: A, B, C, and D. The type is indicated in the device name in parantheses. The commonly used LCC is the "C" kind. |
| QFP | QF | Quad Flatpack, a package with leads on all four sides. It can be ceramic, metal or plastic; bumpered. Devices are named for their body width, length, and thickness, (none includes leads), followed by their lead pitch and version, if applicable. |
| QFN | QN | Quad Flat No Lead Packages (QFN) or VQFN Very Thin, or Micro Leadframe Quad (MLPQ)-Very Thin (HP-VQFP-N, Thickness-1.0 mm), Very Very Thin (HP-WFQFP-N,-Thickness-0.8 mm), Ultra Thin-0.65, Extremely Thin-0.5mm) |
| QSOP | QS | Quarter-size Small Outline Package, [See: SSOP]. The body width is indicated in the parantheses. |
| TQFN | QT | Thermally Enhanced Plastic Thin Fine Pitch Quad Flat No Lead Package. This is a QFN device, with double row of leads in some cases.The fourth character after the "/" in the JEDEC designator field denotes the #of rows: A - Single Row & B- Double Row |
| QVSOP | QV | Quarter-size Very Small Outline Package. |
| Relay | RL | Relay |
| SMC's | SA | Super Miniature Case Rectifiers. These are two leaded C-bend devices. They are primarily used in Diode and Rectifer applications. JEDEC designator: R-PDSO-C2 |
| SOD | SD | Small Outline Diodes |
| SMCGs | SG | Super Miniature Case Rectifiers. These are essentially SMCs, but with gull wings as opposed C-bend leads. They are primarily used in Diode and Rectifer applications. JEDEC designator: R-PDSO-G2 |
| Switch | SH | Switch |
| SIP | SI | Single In-line Package |
| SKPQ | SK | Socket for PQCC |
| SOIC | SO | Small Outline Integrated Circuit. SOIC-08 (5.30) and SOIC-16 (4.57) are not JEDEC approved package styles, but nonetheless are commonly used. |
| Splicing | SP | Splicing of client-supplied carrier strips onto leaders and trailers. |
| SQFN | SQ | Plastic Quad No-Lead Staggered Multi-Row Packages. JEDEC Designator-HP-WFQFP-N & HP-UFQFP-N. They come in three styles: 2-row without ring, 2-row with ring, and 3-row without ring. The number of leads are maximum leads; depopulation is allowed. |
| SSOP | SS | Shrink Small Outline Package. The body width is indicated in the parantheses. [Note: SSOP-36 (5.3) is not a JEDEC approved package style, but nonetheless is commonly used]. |
| SOT | ST | Small Outline Transistor. SOT-143 has multiple pitches: 1.92 & 1.72 mm. Leads to right on SOT-089 Down on SOT-223 |
| Through-Hole (Axial) | TA | Through hole Devices: Axial Technology. Devices with body diameter less than 5 mm classify as "Axial B = 53", body diameter greater than 5mm, but less than 10mm classify as "Axial B = 63". All others, "Axial B = 73" |
| TBGA | TB | TBGA, (Tape Ball Grid Array). TBGA packages are made from strips of Polyamide tape. A metal plate "stiffener" is incorporated on top of the package for added strength. The nominal solder ball diameter for high melt solder balls is 0.63 mm and 0.60mm for low melt. |
| Tant Cap. | TC | Tantalum Capacitors |
| Transformer | TF | Transformers |
| TSOP1 | TH | Thin Small Outline Pkg. 1.0mm Thick, Type 1 has leads extending from the top & bottom ends. The body width is indicated after the "/" in the device name. |
| TSOJ | TJ | Thin Small Outline J-Lead (TSOJ) Package. The depth and body thickness are maximum dimensions, whereas the others are nominal dimenions. |
| TSOC | TL | Thin small-outline C-lead |
| TSOP2 | TN | Thin Small Outline Pkg. 1.0mm Thick, Type II leads extend from the sides, much like an SOIC. Multiple lead types, (like -40/44), have leads missing from the center on each side. |
| Transistor | TO | Transistors, (TO-220's, T-550, Etc.) |
| Through-Hole (Radial) | TR | Through hole Devices: Radial Technology. Devices with body width than 5 mm classify as "Axial B = 53", body diameter greater than 5mm, but less than 10mm classify as "Axial B = 63". All others, "Axial B = 73" |
| TSSOP | TS | Thin Shrink Small Outline Package, These Devices are 1.0mm Thick. The body width is indicated in the parantheses. |
| TFSON | TT | Plastic Thin Shrink Fine Pitch Small Outline No Lead Package. These are essentially TSSOP packages without leads. |
| UBGA | UB | UBGA, (Ultra Fine Line BGA). |
| USON | UN | Ultra-Thin Small Outline No-Lead Package. JEDEC-30 Designator: R-PDSO-N |
| VCO | VC | Voltage Controlled Oscillator |
| WLCSP | WP | WLCSP, Wafer-level Chip-scale Packages. See CB and DB for types. |
| Crystal | XT | Crystal us a generic term used in place of the more complete expression "piezoelectric quartz crystal unit." |
| Zip | ZP | Zip-Zag In-line package. Similar to a SIP, but the leads are in a zip-zag configuration |