The interface between
original component manufacturers such as Intel, AMD, and NVidia and your
assembly line is only as good as the services provided by Value-Added providers such as OX3 helping get these semiconductors from Point A to Point B and quickly.

Any value-added service is
only as good as the data behind it and the quality of its integration/interface. OX3 focuses on maintaining and regularly updating its
large store of packaging materials and services for semiconductors. We have
effective controls in place to ensure that our staff can access that information quickly and successfully by keeping up with technology and synchronizing with our clients' requirements.

MSL is a measure of device sensitivity to moisture. The higher the MSL#, the greater is the sensitivity. There are eight levels: 1, 2, 2a, 3, 4, 5, 5a, and 6. This identification enables users to store and handle the SMDs to avoid subsequent thermal/mechanical damage during reflow attachment and/or repair operations.
A moisture sensitive device is defined as any non-hermetic SMD package that is subjected to solder reflow process during PCB assembly. Based on moisture sensitivity, devices could be classified from level 1 to level 6, with 6 being the most moisture sensitive level. The packaging, handling, and repacking of moisture sensitive components requires steps derived from IPC/JEDEC J-STD-033C dated April 2018, “Joint IPC/JEDEC Standard for Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface Mount Devices.”End-of-life Semiconductor Destruction

The destruction of semiconductors in their End-of-Life phase or for purging parts from inventory consists of distinguishing between the two methods of destruction.

1. Parts are physically destroyed, (either by Hammer or Shredding).
2. Parts are dumped into a mixed lot of “E-Waste.”

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"In the 1960’s and 70’s, following the invention of the transistor, supply came in the form of devices with leads that penetrated through holes on the circuit board.
"Placing semiconductors onto circuit boards developed first with axial leads, (think of the axle of a car's wheelbase), and then to gain real estate both leads were subsequently designed radially to fit onto the circuit board from a single side of each resistor, capacitor, or diode, (think of a man's legs rather than his two outstretched arms."

When electronic components were primarily devices with leads or legs, they often needed to be trimmed, formed, or tinned before placement onto the circuit board.
A vast array of tool & die machine tools were developed over time to accommodate the variety and shape that each formed lead needed to take in order to fit the pattern of an infinite number of circuits.

The physical transfer of materials and services from distant shores to our manufacturing sites in the U.S. is a deeply complicated process that has generated an entire industry devoted solely to moving products from Point A to Point B. OX3 plays its part in this vast market by focusing on semiconductors.
"With partners across the globe, from Asia to Europe to the Sub-continent, we have taken pride in our strengths and shored up our weaknesses while continuing to dedicate our efforts to the import of packaging materials for semiconductors."

"The interface between original component manufacturers such as Intel, AMD, and NVidia and your assembly line is only as good as the services provided by Value-Added providers such as OX3 helping get these semiconductors from Point A to Point B and quickly."
"Any value-added service is only as good as the data behind it and the quality of its integration/interface. OX3 focuses on maintaining and regularly updating its large store of packaging materials and services for semiconductors. We have effective controls in place to ensure that our staff can access that information quickly and successfully by keeping up with technology and synchronizing with our clients' requirements."